NVIDIA HGX

DP Intel 4U Liquid-Cooled System with NVIDIA HGX H100 8-GPU (onsite service is required for liquid-cooling)

Key Applications

High Performance ComputingAI/Deep Learning TrainingIndustrial Automation, RetailHealthcareConversational AIBusiness Intelligence & AnalyticsDrug DiscoveryClimate and Weather ModelingFinance & Economics

Key Features

1. 5th/4th Gen Intel®  Xeon® Scalable processor support
2. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
3. 8 PCIe Gen 5.0 X16 LP
    2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
4. Flexible networking options
5. 2 M.2 NVMe for boot drive only
    Optional: 8x 2.5" Hot-swap  SATA drive bays
    8x 2.5" Hot-swap  NVMe drive bays
6. 4 heavy duty fans with optimal fan speed control
7. 4x 5250W(2+2) Redundant Power Supplies, Titanium Level

Universal 5U Dual Processor (Intel) GPU System with NVIDIA HGX™ H100 4-GPU SXM5 board, NVLINK™ GPU-GPU Interconnect, and Redundant 3000W Titanium Level Power Supplies

Key Applications

High Performance Computing, AI/Deep Learning Training

Key Features

- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
- 10 PCIe Gen 5.0 X16 LP Slots
-  AIOM / OCP 3.0 Support
   AIOM/OCP 3.0 Support
   Flexible networking options
- 10x 2.5" Hot-swap  NVMe/SATA/SAS drive bays
   2 M.2 NVMe and SATA for boot drive only

Universal 4U Dual Processor (Intel) GPU System with NVIDIA HGX™ H100 4-GPU SXM5 board, NVLINK™ GPU-GPU Interconnect, and Redundant 3000W Titanium Level Power Supplies.

Key Applications

High Performance Computing, AI/Deep Learning Training

Key Features

- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
- 8 PCIe Gen 5.0 X16 LP Slots
- Flexible networking options
- 2 M.2 NVMe and SATA for boot drive only
  6x 2.5" Hot-swap  NVMe/SATA/SAS drive bays

Key Applications

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics

Key Features

- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
- 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots
- Flexible networking options
- 12x 2.5" Hot-swap  NVMe drive bays
   2 M.2 NVMe for boot drive only
   8x 2.5" Hot-swap  SATA drive bays
- 10 heavy duty fans with optimal fan speed control
-  6x 3000W (3+3) Redundant Power Supplies, Titanium Level
   Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level

• High Performance Computing
• AI/Deep Learning Training

Barebone 2U Rackmount SuperServer Dual 3rd Gen Intel Xeon Scalable processors, Intel C621A chipset, Up to 12TB in 32 DIMM Slots, SATA3, NVMe and M.2, 4x 2.5in SATA/SAS drive bays, 2x M.2 NVMe or 2x M.2 SATA3, 2x 10GbE BaseT LAN Ports, 3000W Redundant Power Supply (CSE-228GTS-R3K02P + X12DPG-QR-P)

- Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio
- Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect
- Supports HGX A100 4-GPU
- Dual AMD EPYC™ 7003 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
- 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
- 8 PCI-E 4.0 x16 1:1 connection to 8 NICs
- 2 PCI-E 4.0 x16 LP via CPUs
- 10 hot-swap 2.5" U.2 NVMe/SATA/SAS hybrid drive bays
- 5 hot-swap heavy-duty cooling fans

1. Supports NVIDIA® HGX™ A100 8-GPU;
Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™;
NICs for GPUDirect RDMA (1:1 GPU Ratio)
2. Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e)
3. Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
4. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
5. 8 PCI-E 4.0 x16 via PCI-E switch;
1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs;
AIOM Support
6. 6 Hot-swap U.2 NVMe 2.5" drive bays
(4 via PCI-E switch, 2 via CPU)
Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system
7. Flexible Networking via AIOM,
1 dedicated IPMI LAN Port
8. 4 Hot-swap heavy-duty cooling fans
9. 3000W (2+2) Redundant Titanium Level (96%+) Power Supplies
(full redundancy based on configuration and application load)

- 24 DIMM Slots;
Up to 6TB DRAM;
4800 ECC DDR5 LRDIMM;RDIMM;
- 8 PCI-E Gen 5.0 X16 LP, 2 PCI-E Gen 5.0 X16 FHFL Slots
- Flexible networking options
- 1 M.2 NVMe for boot drive only
12x 2.5" Hot-swap  NVMe drive bays
2x 2.5" Hot-swap  SATA drive bays
- 10 heavy duty fans with optimal fan speed control
- 8x 3000W redundant Titanium level power supplies

- Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
Intel® C621A Chipset
- 32 DIMM Slots;
Up to 8TB DRAM;
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM
- 4U system with NVIDIA® HGX™ A100 4-GPU
6 PCI-E Gen 4.0 X16 LP Slots
Highest GPU communication using NVIDIA® NVLINK™
Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
- Flexible networking options
- 1 M.2  NVMe/SATA via Intel® C621A PCH chipset (for boot drive only)
Up to 10x 2.5" Hot-swap  NVMe/SATA drive bays
- 5 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
- 4x 3000W redundant Titanium level power supplies

- 32 DIMM Slots;
Up to 8TB DRAM;
Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM);
3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
- Intel® Optane™ Persistent Memory 200 series
- 10 PCI-E Gen 4.0 X16 LP Slots
 AIOM/OCP 3.0 Support
- Flexible networking options
- 2 M.2 NVMe and SATA for boot drive only
6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
 - 4 heavy duty fans with optimal fan speed control
 - 1x 6000W power supply for OCP