Storage SuperServer SSG-221E-NE324R (Complete System Only )

PCODE: SSG-221E-NE324R

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Key Applications

Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution

Key Features

- Dual Socket E (LGA-4677) 5th/4th Generation Intel® Xeon® Scalable processors. Up to 350W TDP.
- Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM DDR5-5600 ECC memory
- Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant)
- 24x hot-swap E3.S (7.5mm) NVMe drive bays
- Redundant Titanium 2000W Power Supplies

Thông tin (Technical Specifications)

Product SKUs
SSG-221E-NE324R	SuperServer SSG-221E-NE324R (Silver)
Motherboard
Motherboard	Super X13DSF-A
Processor/Cache
CPU	Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Note	Supports 145W - 350W TDP CPUs (Air Cooled)
System Memory
Memory	Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM View Memory Options
Memory Voltage	1.1 V
On-Board Devices
Chipset	Intel® C741
Network Connectivity	Via AIOM View AIOM Options View AOC Options
NVMe	View NVMe Options
Management
Software	SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) SuperDoctor® 5 Super Diagnostics Offline TAS: Supermicro Thin-Agent Service (TAS) SAA(new!)
Power configurations	Power-on mode for AC power recovery ACPI Power Management
Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory 7 Phase-switching voltage regulator
FAN	Status monitor for speed control
	Pulse Width Modulated (PWM) fan connectors
	Fans with tachometer monitoring
Temperature	Monitoring for CPU and chassis environment
	Thermal Control for fan connectors
Chassis
Form Factor	2U Rackmount
Model	CSE-236E3-R2K08P
Dimensions and Weight
Height	3.5" (89.8 mm)
Width	17.2" (437mm)
Depth	30.8" (789.9 mm)
Package	10" (H) x 26.5" (W) x 43.25" (D)
Weight	Gross Weight: 77 lbs (34.93 kg)
	Net Weight: 55 lbs (24.95 kg)
Available Colors	Silver
Expansion Slots
PCI-Express (PCIe) Configuration	Default 4 PCIe 5.0 x8 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) Option A 2 PCIe 5.0 x8 FHHL slot(s) 1 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) Option B 2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible) View AOC Options
Drive Bays / Storage
Drive Bays Configuration	Default: Total 24 bay(s) 24 front hot-swap E3.S 1T NVMe drive bay(s)
M.2	2 M.2 NVMe/SATA slot(s) (M-key 2280/22110) View M.2 Options
System Cooling
Fans	4 Heavy Duty 8cm Fan(s)
Power Supply
Power Supply	1x 2000W Redundant Titanium Level power supply
Dimension (W x H x L)	73.5 x 40 x 203 mm
AC Input	1000W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 1980W: 220-230Vac / 50-60Hz 2000W: 220-240Vac / 50-60Hz (for UL only) 2000W: 230-240Vac / 50-60Hz 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V	Max: 83A / Min: 0A (100Vac-127Vac) Max: 150A / Min: 0A (200Vac-220Vac) Max: 165A / Min: 0A (220Vac-230Vac) Max: 166A / Min: 0A (230Vac-240Vac)
+12Vsb	Max: 3.5A
Output Type	Backplanes (gold finger)
Operating Environment
RoHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
	Operating Relative Humidity: 8% to 90% (non-condensing)
	Non-operating Relative Humidity: 5% to 95% (non-condensing)
	Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)